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BS EN IEC 63251:2023 | 31 Dec 2023 | BSI Knowledge
Standard
BS EN IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Current
•
Published:
31 Dec 2023
Overview
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References
History
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Product Details
Descriptors
Test methods
Printed-circuit boards
Stress
Thermal stress
Reliability
Assessed reliability
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
Identical to:
EN 63251 Ed.1.0
IEC 63251 Ed.1.0
ISBN
978 0 539 05206 0
Publisher
BSI