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IEC 63251:2023 | 1 Nov 2023 | BSI Knowledge
Standard
IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Current
•
Published:
1 Nov 2023
Overview
Preview
References
History
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Product Details
Descriptors
Test methods
Printed-circuit boards
Stress
Thermal stress
Reliability
Assessed reliability
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
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ISBN
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Publisher
IEC