Search BSI Knowledge
Cookie Settings
PD IEC TR 63378-1:2021 | 31 Jan 2022 | BSI Knowledge
Publication
PD IEC TR 63378-1:2021
Thermal standardization on semiconductor packages - Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Current
•
Published:
31 Jan 2022
Overview
Preview
References
History
Visit the preview section for more information
Product Details
Descriptors
Standardization
Semiconductors
Packages
Thermal resistance
Accuracy
ICS Codes
31.080.01 Semiconductor devices in general
Committee
EPL/47
International relationships
Identical to:
IEC/TR 63378-1 Ed.1.0
ISBN
978 0 539 17152 5
Publisher
BSI