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IEC 63378-6:2026 | 4 Feb 2026 | BSI Knowledge
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IEC 63378-6:2026
Thermal standardization on semiconductor packages - Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
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Published:
4 Feb 2026
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Product Details
Descriptors
Semiconductor materials
Semiconductor technology
Resistance (thermal)
Shock resistance (thermal)
Capacitance measurement
ICS Codes
31.080.01 Semiconductor devices in general
Committee
EPL/47
International relationships
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ISBN
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Publisher
IEC