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IEC 63378-3:2025 | 6 May 2025 | BSI Knowledge
Standard
IEC 63378-3:2025
Thermal standardization on semiconductor packages. - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
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Published:
6 May 2025
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Product Details
Descriptors
Semiconductor manufacture
Semiconductor materials
Semiconductor technology
Protection (thermal)
Resistance (thermal)
Stability (thermal)
Thermal measuring
Thermal diffusion
ICS Codes
31.080.01 Semiconductor devices in general
Committee
EPL/47
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ISBN
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Publisher
IEC