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BS IEC 63378-2-1:2024 | 31 Oct 2024 | BSI Knowledge
Standard
BS IEC 63378-2-1:2024
Thermal standardization on semiconductor packages - 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages
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Published:
31 Oct 2024
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Product Details
Descriptors
Standardization
Semiconductors
Packages
Thermal resistance
Accuracy
Mathematical models
Models (testing)
ICS Codes
31.080.01 Semiconductor devices in general
Committee
EPL/47
International relationships
Identical to:
IEC 63378-2-1:2024
ISBN
978 0 539 25899 8
Publisher
BSI