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IEC 61189-2-801:2023 | 26 Jul 2023 | BSI Knowledge
Standard
IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Thermal conductivity test for base materials
Current
•
Published:
26 Jul 2023
Overview
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References
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Product Details
Descriptors
Performance
Thermal conductivity
Structures
Printing board
Test methods
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
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ISBN
978-2-8322-7258-9
Publisher
IEC