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BS EN IEC 61189-2-803:2023 | 30 Sep 2023 | BSI Knowledge
Standard
BS EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for Z-axis expansion of base materials and printed boards
Current
•
Published:
30 Sep 2023
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Product Details
Descriptors
Electronic equipment and components
Laminates
Structures
Printing board
Test methods
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
Identical to:
EN 61189-2-803 Ed.1.0
IEC 61189-2-803 Ed.1.0
ISBN
978 0 539 01306 1
Publisher
BSI