Standard

BS EN IEC 61189-2-501:2022

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

Current

•

Published:

31 May 2022

1 Scope

This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.

Product Details

Descriptors

Test methods

Printing board

Structures

Assembly

Measurement

Resilience

ICS Codes

31.180 Printed circuits and boards

Committee

EPL/501

International relationships

Identical to:

EN 61189-2-501 Ed.1.0

IEC 61189-2-501 Ed.1.0

ISBN

978 0 539 12503 0

Publisher

BSI