Standard

BS EN IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for materials for interconnection structures. Decomposition temperature (T_d) using TGA

Current

•

Published:

30 Nov 2021

1 Scope

This part of IEC 61189 specifies a test method to determine the decomposition temperature (T_d) of base laminate materials using thermogravimetric analysis (TGA).

Product Details

Descriptors

Structures

Open systems interconnection

Printing board

Testing methods

ICS Codes

31.180 Printed circuits and boards

35.100.01 Open systems interconnection in general

Committee

EPL/501

International relationships

Identical to:

IEC 61189-2-807 Ed.1.0

EN 61189-2-807 Ed.1.0

ISBN

978 0 539 12605 1

Publisher

BSI