BS EN 61189-3-719 is an international standard that covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies. The main objective of the BS EN 61189 series is to demonstrate the reliability of laminate materials and assemblies and avoid printed circuit board failures.
BS EN 61189-3-719 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
BS EN 61189-3-719 on monitoring of single (PTH) resistance change during temperature cycling is useful for:
A plated through-hole (PTH) is a conductive conduit that connects one layer of the board to another. Monitoring of single (PTH) resistance change during temperature cycling, ensures the operability, performance and longevity in electrical applications.
BS EN 61189-3-719 provides a description of test methods and guidance for evaluating equipment or components under thermo-mechanical stress induced by temperature cycling, ensuring stable operations with variance in temperature.
The test provided in BS EN 61189-3-719 to determine the resistance of exposure to alternating extremes of high and low temperatures. BS EN 61189-3-719 is intended to represent the heat impact on a PCB during reflow and possibly subsequent selective soldering processes.
Guidance in BS EN 61189-3-719 helps you to ensure that equipment and components can survive the environments to which they will be subjected throughout their useful life, thus positively impacting the service-life of products.
Overall, BS EN 61189-3-719 protects you from the environment, oxidation, moisture, and contamination, and offers a better surface for soldering components during printed circuit board construction (PCBA).
EN 61189-3-719:2016
IEC 61189-3-719:2016