PD IEC/TS 61189 covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies. The main objective of the IEC 61189 series is to demonstrate the reliability of laminate materials and assemblies and avoid printed circuit board failures.
PD IEC/TS 61189-3-301 is an international standard for electric materials that specifies the test methods for materials and assemblies which is helpful in measuring the ionic residues which are dissolved in ionic contamination solutions.
PD IEC/TS 61189-3-301 outlines a way to determine the appearance of non-uniformity of both the luster and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold, nickel, and copper plating in PWBs.
PD IEC/TS 61189-3-301 on appearance inspection method for plated surfaces on PWB is relevant to:
Inspection of printed circuit boards is an important part of any electronics manufacturing process. PCB inspection allows for the detection of problems as soon as feasible following the manufacturing process. As a result, PCB inspection is an important part of every PCB manufacturing process.
Guidance in PD IEC/TS 61189-3-301 helps you to ensure that equipment and components can survive the environments to which they will be subjected throughout their useful life, thus positively impacting the service-life of products.
Overall, PD IEC/TS 61189-3-301 protects you from the environment, oxidation, moisture, and contamination, and offers a better surface for soldering components during printed circuit board construction (PCBA).
IEC TS 61189-3-301:2016