BS EN 61189-3:1997

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Test methods for interconnection structures (printed boards)

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Product Details

Descriptors

Visual inspection (testing)

Electronic equipment and components

Environmental testing

Printed circuits

Electrical insulating materials

Thermal testing

Test specimens

Specimen preparation

Temperature

Solderability testing

Peeling tests

Thermal-shock tests

Printed-circuit boards

Mechanical testing

Damp-heat tests

Accuracy

Test equipment

Adhesion tests

Reports

Precision

Humidity

ICS Codes

31.180 Printed circuits and boards

31.190 Electronic component assemblies

Committee

EPL/501

International relationships

Identical to:

EN 61189-3:1997/A1:1999

IEC 61189-3:1997/AMD1:1999

ISBN

0 580 27850 6

Publisher

BSI