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IEC 61189-2-803:2023 | 26 Jul 2023 | BSI Knowledge
Standard
IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
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Published:
26 Jul 2023
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Product Details
Descriptors
Electronic equipment and components
Laminates
Structures
Printing board
Test methods
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
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ISBN
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Publisher
IEC