BS EN 61189-11 is the 11th part of an international standard used for electrical materials, printed boards, and other interconnection structures. By using BS EN 61189-11 you can manufacture good quality solder alloys which are used in electronic equipment.
BS EN 61189-11 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.
BS EN 61189-11 on Test methods for electrical materials, printed boards and other interconnection structures and assemblies is useful for:
Solder is a metal alloy used to create strong permanent bonds. Solder alloy is useful in the soldering process where these alloys are melted to join the metallic surfaces.
BS EN 61189-11 specifies the test methods and test procedures for determining the melting ranges of solder alloys. The test methods are as follows:
This test method ensures the sustainability of these solder alloys in different climatic conditions. By applying BS EN 61189-11 you can manufacture good quality solder alloys which are used in electronic equipment.
EN 61189-11:2013
IEC 61189-11:2013