BS EN IEC 61189-5-501:2021

What is BS EN IEC 61189‑5‑501 about?  

BS EN IEC 61189‑5‑501 is used to quantify the deleterious effects of flux residues on the surface insulation resistance (SIR) in the presence of moisture. 

Interdigitated comb patterns comprising long parallel electrodes on an IPC B53 standardized test coupons are used for the evaluation. Coupons are conditioned and measurements are taken at a high temperature and humidity.  

Who is BS EN IEC 61189‑5‑501 for? 

BS EN IEC 61189‑5‑501 on test methods for electrical materials and testing of solder fluxes is useful for: 

• Manufacturers of printed circuit boards 
• Production workers on the assembly line 
• Quality assurance team 
• Electrician and electrical engineers 

Why should you use BS EN IEC 61189‑5‑501?  

A solder flux holds the component and the circuit board together while maintaining electric connectivity. The fluxes functionality might get compromised due to the environment inside the semiconductor device.  

BS EN IEC 61189‑5‑501 describes a coupon testing method that helps you to identify the surface insulation resistance of the solder flux. This test method helps you to evaluate the performance of solder flex at high temperatures and in presence of moisture.  

BS EN IEC 61189‑5‑501 guidelines help you to identify the solder fluxes that are most durable and reliable for use in printed circuit boards.