BS EN 61189-5-1 is an international standard that covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies.
The main objective of the BS EN 61189 series is to facilitate reference to the tests, to retain the consistency of presentation, and to provide for future expansion.
BS EN 61189-5- is a catalog of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
BS EN 61189-5-1 contains the types of content of the IEC 61189-5 series, as well as guidance documents and handbooks for printed board assemblies.
BS EN 61189-5-1 on monitoring of single (PTH) resistance change during temperature cycling is useful for:
The process of connecting electronic components to printed circuit board wire is known as printed circuit board assembly. IEC 61189 relates to testing methods for printed boards and printed board assemblies and related materials or component robustness, irrespective of their method of manufacture.
BS EN 61189-5-1 is divided into separate parts, covering information for the designer and the test methodology engineer or technician, enabling them to standardize the processes related to printed board assemblies. BS EN 61189-5-1 provides you with test methods for evaluating printed board assemblies as well as materials used in the manufacture of electronic assemblies. The methods are self-contained, with sufficient detail and description to achieve uniformity and reproducibility in the procedures and test methodologies. BS EN 61189-5-1 also provides you with specific test methods in complete detail to permit implementation with minimal cross-referencing to other specific procedures. As a result, to accommodate updating and improving the methods as industry requirements change or demand new methodology.
Overall, BS EN 61189-5-1 will allow you to make it easier to refer to the exams, maintain consistency in presentation, and plan for future growth.
EN 61189-5-1:2016
IEC 61189-5-1:2016