1 Scope
This part of IEC 61189
describes the thermal transient method to characterize the thermal resistance of
an assembly consisting of a heat source (e.g. power device), an attachment material
(e.g. solder) and a dielectric layer with electrode. This method is suitable to determine
the thermal resistance of materials and assembly methods as well as to optimize the
thermal flux to a heat sink.
NOTE This method is not intended to measure and specify the value of the thermal resistance
of a dielectric material. For that purpose, other standards exist. Examples are given
in Annex A.