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IEC 61189-2-804:2023 | 25 Aug 2023 | BSI Knowledge
Standard
IEC 61189-2-804:2023
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Test methods for time to delamination. T260, T288, T300
Current
•
Published:
25 Aug 2023
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Product Details
Descriptors
Testing methods
Electrical equipment
Electrically-conducting materials
Printed-circuit boards
Delamination
Thermo-mechanical separation
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
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ISBN
978-2-8322-7422-4
Publisher
IEC