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IEC 61189-2-808:2024 | 25 Apr 2024 | BSI Knowledge
Standard
IEC 61189-2-808:2024
Test methods for electrical materials, printed board and other interconnection structures and assemblies. - Part 2-808: Thermal resistance of an assembly by thermal transient method
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Published:
25 Apr 2024
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Product Details
Descriptors
Testing methods
Electrical connections
Electrical conductivity
Electrically-conducting materials
Printing board
Thermal resistance
Thermal behaviour of structures
ICS Codes
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
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ISBN
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Publisher
IEC