The IEC 61189 series covers test methods for electrical materials, printed boards, and other interconnection structures and assemblies as well as related materials or component robustness, irrespective of their method of manufacture. The main objective of the IEC 61189 series is to demonstrate the reliability of laminate materials and assemblies and avoid printed circuit board failures.
BS EN 61189-6 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies. The tests provided in BS EN 61189-6 are grouped according to the following principles:
BS EN 61189-6 on material testing for electronic assemblies is useful for:
Material Analysis is performed to detect and identify the materials used in the manufacturing of electronic components and packages. BS EN 61189-6 introduces test methods for evaluating materials used in manufacturing electronic assemblies. The methods are self-contained, with sufficient detail and description, which helps to achieve uniformity and reproducibility in the procedures and test methodologies.
BS EN 61189-6 provides you with specific test methods in complete detail to permit implementation with minimal cross-referencing to other specific procedures.
BS EN 61189-6 guidelines help in monitoring a process, enhancing confidence in quality conformance, and arbitrating between customer and supplier. BS EN 61189-6 demonstrates the reliability and performance of electronic assemblies.
EN 61189-6:2006
IEC 61189-6:2006