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IEC 61189-2-809:2024 | 9 Dec 2024 | BSI Knowledge
Standard
IEC 61189-2-809:2024
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies. - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
Current
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Published:
9 Dec 2024
Overview
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References
History
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Product Details
Descriptors
Materials by form
Printed-wiring boards
Printing board
Boards
Board (paper)
ICS Codes
29.035.10 Paper and board insulating materials
31.180 Printed circuits and boards
Committee
EPL/501
International relationships
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ISBN
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Publisher
IEC