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PD IEC TR 61760-3-1:2022 | 31 Oct 2022 | BSI Knowledge
Standard
PD IEC TR 61760-3-1:2022
Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
Current
•
Published:
31 Oct 2022
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References
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Product Details
Descriptors
Components
Electrical components
Circuits
Integrated circuits
Surface mounting devices
Solders
ICS Codes
31.190 Electronic component assemblies
Committee
EPL/501
International relationships
Identical to:
IEC/TR 61760-3-1 Ed.1.0
ISBN
978 0 539 17936 1
Publisher
BSI