This part of IEC 61760 specifies the classification of moisture sensitive device (3.1) into moisture sensitivity level (3.2) related to soldering heat, and provisions for packaging, labelling and handling.
It extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases, this document introduces additional moisture sensitivity levels and an alternative method for packaging.
This document applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to
semiconductor devices,
devices for flow (wave) soldering.
NOTE Background of this document and its relation to currently existing standards, e.g. IEC 60749-20 [1] or J-STD-020F [2] and J-STD-033 [3], are described in the Introduction.