Standard

Withdrawn

BS 4584-10:1977

Specification for metal-clad base materials for printed circuits - Flexible copper-clad polyimide film: PI-F-Cu-10

Published:

30 Nov 1977

•

Withdrawn:

28 Jun 1991

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Product Details

Descriptors

Electrical resistivity

Metal coatings

Dissipation factor

Packaging

Flammability

Weight (mass)

Printed-circuit bases

Test equipment

Adhesion tests

Dimensional measurement

Copper

Thickness measurement

Fatigue testing

Electrical resistance

Mechanical testing

Dimensional changes

Density

Printed-circuit boards

Tensile strength

Films (states of matter)

Thickness

Flexible materials

Adhesive strength

Tensile testing

Permittivity

Laminates

Fire tests

Fatigue

Bend testing

Weight measurement

Elongation at fracture

Density measurement

Surface properties

Defects

Polymers

Coated materials

Printed circuits

Dimensions

Foil

Marking

Dimensional tolerances

Soldering

Electronic equipment and components

Dielectric strength

ICS Codes

31.180 Printed circuits and boards

Committee

—

International relationships

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ISBN

0 580 09557 6

Publisher

BSI