BS EN ISO 9455-17:2006

Soft soldering fluxes. Test methods - Surface insulation resistance comb test and electrochemical migration test of flux residues

Published:

21 Mar 2003

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Withdrawn:

25 Jan 2024

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This British Standard is an adoption of an ISO standard. You can access the ISO version here.

BS EN ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders (ISO 9453:1990, Class E).

This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

Product Details

Descriptors

Electrical resistance

Migration (chemical)

Fluxes (materials)

Electrochemical methods

Soldering

Surface properties

Electrical properties of materials

Electrical insulation

Electrical testing

Resistance measurement

Testing conditions

ICS Codes

25.160.50 Brazing and soldering

Committee

EPL/501

International relationships

Identical to:

ISO 9455-17:2002

EN ISO 9455-17:2006

ISBN

0 580 41451 5

Publisher

BSI