ISO 9455‑5 is the fifth element of the multi-series international standard that covers the soft soldering fluxes.
ISO 9455‑5 gives technical specifications such as terms, definitions, principles, reagents, apparatus, procedure, assessment, expression of results, and test reports for copper mirror test. It specifies a qualitative method for assessing the aggressiveness of flux towards copper.
Note: The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.
ISO 9455‑5 on copper mirror test is applicable to:
Fluxes assist molten solder in wetting metal surfaces to be connected by eliminating oxides and other impurities from the solder and the surfaces of the parts during soldering. Fluxes also prevent surfaces from oxidation and help molten solder moisten the base metals.
ISO 9455‑5 guides you for copper mirror test, to determine the flux reactivity due to the presence of free halide activators. It is very important to check the presence of amines in the flux, as they can mislead the results where the flux appears to pass the test, when in fact it has a highly reactive composition.
ISO 9455-5 specifies the factors for carrying out the copper mirror test such as reagents, apparatus, preparation of the flux test samples, etc, which can be considered while performing the test on fluxes. It also gives you provisions for potential health and safety hazards that help to improve the quality of metallic welded joints and assemblies and are beneficial for the health and safety of workers.
BS EN ISO 9455‑5:2020 supersedes BS EN ISO 9455‑5:2014, which is withdrawn. BS EN ISO 9455‑5:2020 includes some technical changes as follows:
EN ISO 9455-5
ISO 9455-5