Soft soldering fluxes. Test methods - Cleanliness of soldered printed circuit assemblies before and/or after cleaning
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1 Scope
This document specifies test methods for the cleanliness of soldered printed circuit
assemblies before and/or after soldering and cleaning. The test is applicable to all
fluxes as defined in ISO 9454‑1.
BSI recommends this version of standard for organisations operating in or with the UK. The ISO edition is available here if required.