BS EN ISO 9453:2020

What is ISO 9453 about? 

ISO 9453 is an international standard that deals with soft solder alloys. 

ISO 9453 specifies the requirements for chemical composition, forms of delivery, sampling, analysis as well as marking and labelling for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. 

An indication of the forms generally available is also included in ISO 9453. 

Who is ISO 9453 for? 

ISO 9453 on soft solder alloys applicable to: 

• Electronic and electrical Industries 
• Soft solder alloys manufacturers 
• Welding equipment manufacturers 
• Manufacturer of aircraft & aerospace 
• Automotive, mechanical Industries 

Why should you use ISO 9453? 

Solder is a metal alloy that is used to form a permanent bond between metal workpieces. The solder is melted after cooling to stick to and connect the metal pieces.  

ISO 9453 enables you to manufacture and use soft solder alloys in accordance with the standard chemical composition which helps you improve the quality and durability of metal welded joints. 

The guidelines in ISO 9453 could help you in better manufacturing and using efficient and cost-effective soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, etc. elements. 

What’s changed since the last update? 

BS EN ISO 9453:2020 supersedes BS EN ISO 9453:2014, which is withdrawn. BS EN ISO 9453:2020 includes some technical changes as follows: 

• Alloys 303 and 304 have been added to Table 3 and Table A.1 
• Table A.1 has been updated according to IEC 61190-1-3 
• Patent information was updated on the relevant ISO web page and Annex B was removed