BS EN 62258-5 is the fifth part of the multi-series standard that deals with the aspects of semiconductor die products.
BS EN 62258-5 specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behavior and verification of the correct functionality of electronic systems. The systems include a bare semiconductor die, with or without connection structures, and/or a minimally packaged semiconductor die.
BS EN 62258-5 on semiconductor die products is useful for:
The series BS EN 62258 regards an electronic system, composed of several processing elements (active components) that apply non-linear transformations to the electrical signals. It is connected to other electronic systems using an interconnection network that ideally leaves the electrical signals unaltered (interconnections on the substrate) or applies linear transformations to them (passive components). It consists of ICs and discrete components assembled on an interconnection substrate or board.
BS EN 62258-5 is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2. A die is a small block of semiconducting material on which a given functional circuit is fabricated.
BS EN 62258-5 specifies the requirements and recommendations, that apply to electrical simulation models used to perform the following simulations:
BS EN 62258-5 facilitates the production, supply, and application of semiconductor die products, including wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die, and wafers.
EN 62258-5:2006
IEC 62258-5:2006