Semiconductor devices - Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
Current
•
Published:
1 Scope
This part of IEC 62374 describes a test method, test structure and lifetime estimation method of the time-dependent
dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
Product Details
Descriptors
Electrical measurement
Semiconductors
Dielectric breakdown
Life (durability)
Testing conditions
Semiconductor devices
Films (states of matter)
ICS Codes
29.140.20 Incandescent lamps
31.080.01 Semiconductor devices in general
43.040.20 Lighting, signalling and warning devices