BS EN 62047-3 is the third part of the multi-series standard that focuses on aspects of semiconductor devices.
BS EN 62047-3 specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin-film materials with length and width under 1 mm and thickness under 10 μm, which are the main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices.
BS EN 62047-3 on Thin film tensile testing is useful for:
Micro-electromechanical systems (MEMS) are a process technology that is useful in creating tiny integrated devices or systems. These devices are useful in combining mechanical and electrical components.
BS EN 62047-3 is based on the concept that a tensile testing system can be guaranteed propriety and accuracy, when the measured tensile strengths of the standard test pieces, whose tensile strength is pre-determined, are within the designated range.
BS EN 62047-3 specifies the methodology to test the working of micro-electromechanical devices which enables users to check the compliance of its specific features according to global standards. It gives technical requirements for carrying out the test procedure, which helps them in determining the tensile strength of thin-film material used in micro-electromechanical devices.
BS EN 62047-3 gives you detailed information about the testing methods and test apparatus needed to perform the test, which helps the users to prepare the test specimen, estimate the fabrication of the test piece, plane shape, gauge mark, and thickness of the test piece for understanding the tensile strength of the thin film.
By applying BS EN 62047-3, you can manufacture excellent quality materials and hence micro-electromechanical devices used in MEM systems (MEMS).
EN 62047-3:2006
IEC 62047-3:2006