BS EN 62047-15 is the 15th part of a multi-series standard used for semiconductor devices.
BS EN 62047-15 describes the test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for the building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high-pressure applications as in the case of certain peristaltic pump designs where an off-chip compressed air supply is used to drive the fluids in micro-channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS. Also, in the case of systems having pneumatic microvalves, a relatively high level of bonding, particularly between two replica moulded layers of PDMS becomes quite necessary. Usually, there is a leakage and debonding phenomena between the interface of bonded areas, which causes instability and shortage of lifetime for MEMS devices. BS EN 62047-15 specifies general procedures on bonding tests of PDMS and glass chip.
BS EN 62047-15 on Semiconductor devices is useful for:
A semiconductor device is an electronic component that contains the electronic properties of semiconductor material.
BS EN 62047-15 can be your best guide in conducting the test method for bonding strength between PDMS and glass. The test methods are as follows:
By applying BS EN 62047-15, you can calculate the bond strength between PDMS and glass that results in manufacturing better quality semiconductor devices.
EN 62047-15:2015
IEC 62047-15:2015