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Standard

BS IEC 62047-38:2021

Semiconductor devices. Micro-electromechanical devices - Test method for adhesion strength of metal powder paste in MEMS interconnection

Current

•

Published:

31 Jul 2021

Overview
Preview
References
History
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Product Details
Descriptors
Vocabulary
Electromechanical devices
Integrated circuits
Terminology
Electronic equipment and components
Semiconductor technology
Semiconductor devices
ICS Codes
31.080.99 Other semiconductor devices
Committee
EPL/47
International relationships
Identical to:

IEC 62047-38 Ed.1.0

ISBN
978 0 539 06751 4
Publisher
BSI