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BS IEC 62047-47:2024

Semiconductor devices. Micro-electromechanical devices - Silicon based MEMS fabrication technology. Measurement method of bending strength of microstructures

Current

•

Published:

31 Aug 2024

Overview
Preview
References
History
Product Details
Descriptors
Semiconductor materials
Electronic devices
Silicon chips
Measurement
Bending strength
Electromechanical devices
ICS Codes
31.080.99 Other semiconductor devices
Committee
EPL/47
International relationships
Identical to:

IEC 62047-47 Ed.1.0

ISBN
978 0 539 21851 0
Publisher
BSI