BS IEC 62047-31:2019

What is BS IEC 62047‑31 - Micro-electromechanical systems (MEMS) materials about ?  

BS IEC 62047‑31 is the 31st part of an international standard used for semiconductor devices that specifies the bending test method. This test method helps in measuring the interfacial adhesion energy in microelectromechanical devices.  

BS IEC 62047-31 is a four-point bending test method for interfacial adhesion energy of layered MEMS materials. BS IEC 62047-31 specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS) based on the concept of fracture mechanics. 

Who is BS IEC 62047‑31 - Micro-electromechanical systems (MEMS) materials for ?  

BS IEC 62047‑31 on semiconductor devices useful for: - 

• Semiconductor foundries 
• Manufacturers of electronic devices 
• Manufacturers of automobiles 
• Electrical engineers  

Why should you use BS IEC 62047‑31 - Micro-electromechanical systems (MEMS) materials ?  

Micro-electromechanical systems (MEMS) is a technology useful in creating integrated devices or systems that are combined with mechanical and electrical properties. 

BS IEC 62047‑31 is useful in measuring the accurate dimensions which help in determining the mechanical properties of micro-electromechanical systems (MEMS) materials. The machining of the devices helps in preventing unintended cracks or flaws in Microelectromechanical devices.  

BS IEC 62047-31 specifies the test methods and test procedures for conducting the tests.  These four bending test methods can help you to utilise the pure bending movements applied to layered micro-electromechanical devices.