BS EN 62047-17 is the 17th part of an international standard used for semiconductor devices.
BS EN 62047-17 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others.
The thickness of the film is in the range of 0,1 μm to 10 μm, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm. The tests are carried out at ambient temperature, by applying a uniformly distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.
BS EN 62047-17 on Semiconductor devices is useful for:
Micro-electromechanical systems (MEMS) is a process technology that is useful in creating tiny integrated devices or systems. These devices are useful in combining mechanical and electrical components.
BS EN 62047-17 specifies the test requirements, test methods and test procedure for conducting the test of Micro-electromechanical devices. This test method is useful in measuring the mechanical properties of the film such as elastic modulus and residual stress. With the help of these properties, you can determine the pressure-deflection curve or stress-strain curve of these devices.
By using BS EN 62047-17, you can ensure the sustainability of these devices in different climatic conditions. This helps in manufacturing better quality Micro-electromechanical devices.
EN 62047-17:2015
IEC 62047-17:2015