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Standard

BS IEC 62047-27:2017

Semiconductor devices. Micro-electromechanical devices - Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

Current

•

Published:

31 Jul 2020

Overview
Preview
References
History
Product Details
Descriptors
Resonance
Vibration
Semiconductor devices
Thin-film devices
Semiconductor technology
Fatigue testing
Electromechanical devices
Integrated circuits
Test specimens
Electronic equipment and components
Test equipment
Bend testing
ICS Codes
31.080.99 Other semiconductor devices
Committee
EPL/47
International relationships
Identical to:

IEC 62047-27:2017

ISBN
978 0 580 89909 6
Publisher
BSI