BS EN 62047-13:2012

What is BS EN 62047-13 - Adhesive strength used in micro-electromechanical structure about?  

BS EN 62047-13 is the 13th part of an international standard used for Micro-electromechanical devices.  

BS EN 62047-13 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively. 

Micro-sized elements of MEMS devices are made up of laminated fine pattern films on a substrate, which are fabricated by deposition, plating, and/or coating with photolithography. MEMS devices include a large number of interfaces between dissimilar materials, at which delamination occasionally occurs during fabrication or in operation. The combination of the materials at the junction determines the adhesive strength; moreover, defects and residual stress in the vicinity of the interface, which is changing by processing condition, strongly affect the adhesive strength. This standard specifies the adhesive testing method for microsized-

elements in order to optimally select materials and processing conditions for MEMS devices. 

This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized. 

Who is BS EN 62047-13 - Adhesive strength used in micro-electromechanical structure for? 

BS EN 62047-13 on Semiconductor devices are useful for: 

• Manufacturers of semiconductor devices 
• Manufacturers of electronic devices 
• Manufacturers of automotive parts 
• Electronic engineers 
• Semiconductor foundries 
• Quality control executives 

Why should you use BS EN 62047-13 - Adhesive strength used in Micro-electromechanical structure?  

Micro-electromechanical systems (MEMS) are a process technology that is useful in creating tiny integrated devices or systems.  These devices are useful in combining mechanical and electrical components. 

BS EN 62047-13 specifies the test method and test procedure for measuring adhesive strength used in Micro-electromechanical structures. This test method is useful in measuring the force at delamination which helps in analysing the adhesive strength between the columnar test piece and substrate. With the help of these test methods, you can ensure the sustainability of these devices in different climatic conditions.  

By applying BS EN 62047-13 you can manufacture good quality adhesives used for Micro-electromechanical structures.