BS EN IEC 60749 is an international standard on semiconductor devices.
BS EN IEC 60749-12 is the 12th part in the multi-series that describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This test method describes a swept sine test.
BS EN IEC 60749-12 is normally applicable to cavity-type packages.
BS EN IEC 60749-12 on variable frequency vibration is relevant to:
Semiconductor devices are electronic components that rely on the electronic properties of semiconductor materials for their function.
The test methods provided under BS EN IEC 60749-12 helps you to avoid any mechanical damage such as cracking, chipping, or breaking that leads to overall product/application failure.
BS EN IEC 60749‑12 also helps identify failures if the parametric limits are exceeded or if functionality cannot be demonstrated under nominal and worst-case conditions.
Overall, BS EN IEC 60749‑12 can help identify and mitigate effects of undue vibration, minimize fatigue, and maintain operational efficiency and service-life of the end-application.
BS EN IEC 60749-12:2018 supersedes BS EN 60749-12:2002, which is withdrawn. BS EN IEC 60749-12:2018 includes some technical changes with respect to BS EN 60749-12:2002. This includes:
IEC 60749-12:2017
EN IEC 60749-12:2018