BS EN IEC 60749-15:2020

What is BS EN IEC 60749‑15 about?  

BS EN IEC 60749‑15 is the 15th part of Semiconductor devices in multi-series.  

BS EN IEC 60749‑15 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. 

Who is BS EN IEC 60749‑15 for? 

BS EN IEC 60749‑15 on Semiconductors is useful for: 

• Semiconductor foundries 
• Electrical engineers 
• Manufacturers of electronic devices 
• Manufacturers of automobile 

Why should you use BS EN IEC 60749‑15?  

A semiconductor device is an electronic component that relies on the electronic properties of a semiconductor material for its function. 

BS EN IEC 60749‑15 helps withstand the soldering temperature without degrading the electrical characteristics or internal connections of Semiconductor devices.  

This BS EN IEC 60749‑15 helps to prevent undue exposure of the part to the heat radiated in mounted devices by the solder bath method and also helps in classifying the failures if the parametric limits are exceeded in nominal or worst conditions.  

What’s changed since the last update?  

BS EN IEC 60749‑15:2020 supersedes BS EN 60749‑15:2010. BS EN IEC 60749‑15:2020 includes some technical changes with respect to BS EN 60749‑15:2010. These include: 

• Inclusion of new Clause 3, Terms and definitions; 
• Clarification of the use of a soldering iron for producing the heating effect; 
• Inclusion an option to use accelerated ageing.