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BS EN 60749-20:2009 | 31 Jan 2010 | BSI Knowledge
Standard
Withdrawn
BS EN 60749-20:2009
Semiconductor devices. Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Published:
31 Jan 2010
•
Withdrawn:
14 Oct 2020
Overview
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Product Details
Descriptors
Plastics
Climate
Thermal testing
Encapsulated
Surface mounting devices
Damp-heat tests
Environmental testing
Electronic equipment and components
Semiconductor devices
Integrated circuits
Soldering
Solderability testing
Mechanical testing
ICS Codes
31.080.01 Semiconductor devices in general
Committee
EPL/47
International relationships
Identical to:
EN 60749-20:2009
EN 62298-3:2005
IEC 60749-20:2008
IEC 62298-3:2005
ISBN
978 0 580 59478 6
Publisher
BSI