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IEC 60749-22-2:2025 | 26 Nov 2025 | BSI Knowledge
Standard
IEC 60749-22-2:2025
Semiconductor devices. Mechanical and climatic test methods - Bond strength. Wire bond shear test methods
Current
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Published:
26 Nov 2025
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Product Details
Descriptors
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ICS Codes
31.080.01 Semiconductor devices in general
Committee
EPL/47
International relationships
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ISBN
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Publisher
IEC