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IEC 60749-22-1:2025 | 26 Nov 2025 | BSI Knowledge
Standard
IEC 60749-22-1:2025
Semiconductor devices. Mechanical and climatic test methods - Bond strength. wire bond pull test methods
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Published:
26 Nov 2025
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Product Details
Descriptors
Semiconductor devices
Strength of materials
Mechanical tests
Integrated circuits
Environmental testing
Electronic equipment and components
Climate
ICS Codes
29.100.10 Magnetic components
31.080.01 Semiconductor devices in general
Committee
EPL/46
International relationships
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ISBN
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Publisher
IEC