What is BS IEC 62951-7 - Thin-film encapsulation about?

BS IEC 62951-7 is the seventh part of an international standard on semiconductor devices.

BS IEC 62951-7 specifies evaluation conditions and gives a method of measurement as well as a test set-up for the measurement of barrier performance for thin-film encapsulation with ultra-low permeation rate under both flat and bending conditions.

Who is BS IEC 62951-7 - Thin-film encapsulation for?

BS IEC 62951-7 is semiconductor devices useful for: -

Semiconductor foundries
Manufacturers of automobiles
Suppliers of semiconductor devices
Manufactures of electronic devices

Why should you use BS IEC 62951-7 - Thin-film encapsulation?

Thin-Film Encapsulation is based on a multi-layer film. These films are made up of alternating organic and inorganic layers. By using BS IEC 62951-7, you can conduct the measuring method for flexible organic semiconductors. This measuring method is for ultra-low permeation rate and general test set-up. With the help of BS IEC 62951-7, you can measure the WVTR when the change of resistance of the Ca sensor is measured. The WVTR under bending conditions is measured for flexible organic electronics.

You can use BS IEC 62951-7 best practice guidance in conducting the test and measuring the performance of thin-film encapsulation for flexible organic semiconductors. This test method helps in producing better quality organic semiconductors devices.

BS IEC 62951-7:2019

Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor

Current

Published:

31 Mar 2019