BS EN 61193-2 is the second part of a multi-series standard used for Quality assessment systems. This helps in manufacturing good quality electronic components and packages which results in preventing these components from external factors.
BS EN 61193-2 applies to the inspection of electronic components and packages, and also modules (referred to as “products” in this standard) for use in electronic and electric equipment. It specifies sampling plans for inspection by attributes on the assumption that the acceptance number is zero (Ac = 0), including criteria for sample selection and procedures. The zero acceptance number sampling plans provided by this standard apply to the inspection of products, that are manufactured under suitable process control with the target of a “zero defect” quality level before sampling inspection.
In addition, this standard provides a method for the calculation of the expected value of the statistical verified quality limit (SVQL) at a confidence level of 60 %. Amongst other things, this method can be used to verify the effectiveness of the supplier’s process control.
Note: In this BS EN 61193-2 the term “module” is used for products that are modules according to the definition in IEC 60194.
BS EN 61193-2 on Inspection of electronic components and packages is useful for:
An electronic component is any basic discrete device or physical entity in an electronic system used to affect electrons or their associated fields. The packing of electronic components is useful for preventing the materials while transporting, storing, and handling these components.
BS EN 61193-2 specifies the sampling systems for these electronic components. With the help of inspection, you can accept or reject these components and packages. These acceptance and rejection criteria depend on the defects and failures of these components. Statistical verified quality limit (SVQL) helps in estimating the average production quality with a certain statistical probability.
By applying BS EN 61193-2, you can ensure the reliability and capability of these electronic
components and packages. This results in standardizing the manufacturing process which helps in producing good quality electronic components and packages. These packages are useful in preventing electronic components from external factors.
EN 50289-3-2:2001
EN 61193-2:2007
IEC 61193-2:2007