PD IEC/PAS 61249-8-5:2014

What is PD IEC/PAS 61249-8-5 - Permanent solder masks and flexible cover materials about?  

PD IEC/PAS 61249-8-5 discusses the qualification and performance specification of permanent solder mask and flexible cover materials.  

PD IEC/PAS 61249-8-5 defines the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask and cover material under evaluation with the minimum of test redundancy. 

Note: This specification shall establish the requirements for: 

• The evaluation of solder mask and cover materials 
• The conformance of solder mask and cover material properties 
• The qualification of the solder mask and cover material via the appropriate test substrate 
• The qualification assessment of the solder mask and cover material in conjunction with the production printed board process 

Note: The determination of compatibility between solder mask and cover materials and post soldering products and processes is beyond the scope of this specification. The use of Test Methods specified herein to determine the compatibility and the requirement to do so shall be as agreed between user and supplier (AABUS). 

Who is PD IEC/PAS 61249-8-5- Permanent solder masks and flexible cover materials for? 

PD IEC/PAS 61249-8-5 on Permanent solder masks and flexible cover materials is useful for: 

• Manufacturer of electronic components 
• Manufacturer of automotive parts 
• Electronic engineer 

Why should you use PD IEC/PAS 61249-8-5 - Permanent solder masks and flexible cover materials?  

A solder mask is a thin layer of polymer that is put on a circuit board. This helps in protecting the copper from oxidation and shorts during operation. 

PD IEC/PAS 61249-8-5 specifies the requirements which are used according to their operational requirements. This also specifies the quality assurance provisions that help in improving the quality of these solder masks and cover materials. With the help of PD IEC/PAS 61249-8-5, you can prevent the formation and adherence of solder balls, solder bridging, solder build-up, and physical damage to the printed board substrate.   

By applying PD IEC/PAS 61249-8-5, you can evaluate the performance of a permanent solder mask and flexible cover materials. This results in manufacturing good quality solder masks and cover materials used on printed boards.