PD IEC TR 62240‑2 is the second part of the PD IEC TR 62240 series.
This part of IEC 62240, which is a Technical Report, focuses on original equipment manufacturers (OEMs) using commercial off-the-shelf (COTS) semiconductor microcircuits for high performance, high reliability, and long-duration applications.
PD IEC TR 62240‑2 supports OEMs in the preparation and maintenance of their semiconductor electronic component management plan (ECMP).
PD IEC TR 62240‑2 describes a process and a method for selecting the digital semiconductor microcircuits by ensuring that their lifetime is compatible with the requirements of aerospace, defense, and high performance (ADHP) applications (generally in connection with functional environments).
Note: IEC 62239-1 can assist OEMs in the creation and maintenance of ECMPs.
Note: SAE ARP6338 can also help the OEM with regard to assessment and mitigation of early wear-out of life-limited semiconductor microcircuits.
Note: With the evolution of electronic technology and semiconductor microcircuits processed of less than or equal to 90 nm feature size, the current MIL-HDBK-217 handbook or FIDES guide become inappropriate as they are based for the time being on the assumption that the semiconductor electronic component exhibits a constant (random) failure rate and does not have life limits or exhibit wear-out.
PD IEC TR 62240‑2 on process management for avionics is useful for:
Electronic equipment for aerospace, defence, and high-performance (ADHP) applications integrate more and more commercial off-the-shelf (COTS) semiconductor microcircuits.
These semiconductor microcircuits are above all designed and produced to address high volume and low-cost markets such as consumer electronics, telecommunications, or microcomputers, whose main requirements are basically cost, integration, performance, and low consumption and for which the long term reliability in severe environments (for example vibration, thermal cycling, humidity, and operating temperature) is not necessarily an imperative design criterion.
PD IEC TR 62240‑2 provides methods and guidelines to assess the long-term reliability of COTS semiconductor microcircuits in such applications; mainly applied during the electronic design phase when selecting semiconductor microcircuits and assessing the application reliability.
Moreover, PD IEC TR 62240‑2 focuses on the intrinsic wear-out and the lifetime of COTS semiconductor microcircuits processed of less than or equal to 90 nm feature size (also called deep sub-micron (DSM) semiconductor microcircuits) and puts aside, at this time, packaging wear-out and random failure mechanisms. In this view, the physics of failure (PoF) is at the heart of the approach.
In this context, the lifetime of new generations of COTS semiconductor microcircuits that may not meet the lifetime requirements of high performance, high reliability, and long duration electronic applications (for example twenty years, thirty years, or more). As a consequence, specific reliability assessment and maintenance plans are considered within the semiconductor microcircuit selection activities.
PD IEC TR 62240‑2 can help you design the plan in such a manner that the requirements specified are addressed clearly and it is understandable to the end-users. By applying PD IEC TR 62240‑2 you can manufacture components that are sustained for a longer period.
IEC TR 62240-2:2018