BS IEC 62899‑501‑1 is a part of the multi-series standard that deals with the specifications for printed electronics.
BS IEC 62899‑501‑1 specifies failure modes and mechanical stress test methods for the determination of reliability characteristics of bendable or flexible printed primary cells and secondary cells and batteries.
BS IEC 62899‑501‑1 provides geometrical cell properties, mechanical characteristics, cell storage conditions such as storage temperature, temperature ranges, storage time, criteria for mechanical package damage, and heat generation for bendable or flexible printed primary cells and secondary cells /batteries.
The technology mentioned BS IEC 62899‑501‑1 on failure modes and mechanical testing of printed electronics is applicable for:
Due to the trend towards a globalized, technological, and connected society, there is a rising demand for a new breed of technologies enabling low-priced, flexible, and new-concept products.
BS IEC 62899‑501‑1 talks about printed electronics that have recently emerged as a promising, environmentally friendly route toward producing electronic, display, or energy storage articles at low cost, enabling new creative technologies such as flexible electronics.
BS IEC 62899‑501‑1 armed with new printing technologies (e. g. ink-jet) and innovative materials, printed electronics proves to be very effective in industrial applications such as photovoltaic devices, signage, RFID, batteries, etc., where cost, flexibility, and recycling are very critical issues.
BS IEC 62899‑501‑1 helps out the manufacturers and suppliers of printed primary / secondary cells and batteries, for successful industrialization of this technology, by informing about reliability, and repeatability in equipment and providing a process that will lead to global standardization.
IEC 62899-501-1:2019