DD IEC/PAS 62326-14 is the 14th part of a multi-series standard used for printed boards.
DD IEC/PAS 62326-14 describes the substrate embedding devices including but not limited to the module, integrated passive device (IPD), microelectrochemical systems (MEMS), discrete component formed in the fabrication process of the electronic wiring board, and sheet form component. Figure 1 shows examples of device embedding in the fabrication process of the device embedded substrate. Active and passive devices are connected to each other by interlayer vias and/or conductor patterns. Insulating layers are formed using insulating materials with vias for the connection of inside conductor patterns to the conductor patterns formed on the surface(s) of the substrate. Figure 2 shows the substrate with connections using pads, and Figure 3 shows the board using via connections.
The insulating layer includes rigid and flexible insulating resins such as phenol resin, epoxy resin, polyimide resin, and modified polyimide resin, which are reinforced with glass cloth, aramid cloth or paper; and resins without reinforcement. Interconnections to the input and output terminals to the embedded device and the surface conductor pattern include conventional interconnection of the terminals of the embedded device to an interconnecting land for SMD, and formation of terminals on the surface of an embedded device by copper plating or vias using conductive paste.
Note: DD IEC/PAS 62326-14 is applicable to device embedded substrates fabricated by embedding discrete active and passive electronic devices into an inner layer of a substrate with electric connections by vias, conductor plating, conductive paste, and printing. The device embedded substrate may be used as a substrate to mount SMDs to form electronic circuits, as conductor and insulator layers may be formed after embedding electronic devices.
Note: DD IEC/PAS 62326-14 does not specify the fabrication process of device embedded substrates, via diameter/via land diameter, conductor width/conductor spacing nor conductor line density.
DD IEC/PAS 62326-14 on Printed boards are useful for:
PCBs mechanically support electronic components using conductive pads in the shape designed to accept the component's terminals. This helps in connecting these PCBs electrically by using traces, and planes.
DD IEC/PAS 62326-14 specifies the test equipment and test method for the un-embedded boards. This test method helps in evaluating a TEG mounted board that helps in obtaining assembly conditions and technical data for designing these boards. With the help of this test method you can resist the conductor, and over current, and also helps in resisting the insulation in these printed boards.
DD IEC/PAS 62326-14 can be your best guide in designing these circuit boards that help in understanding the circuit design, structure design, board design, board manufacturing, and jisso of the product. This ensures reliability and helps in designing and manufacturing good quality printed boards.